PUBLICATIONS
119. Jeng-Yu Lin and Alan C.
West, “Adsorption-Desorption Study of Benzotriazole in Phosphate-Based
Electrolyte for Cu Electrochemical Mechanical Planarization,” Electrochimica Acta, accepted (November, 2009).
118. R. J. von Gutfeld, Joshua W. Gallaway, and Alan C. West, “In
situ Immersion Plating of Copper and Nickel on Aluminum using Laser Pulses for
Oxide Removal,” J. Electrochem. Soc.,
156, D564 (2009).
117. Joshua W. Gallaway and Alan C.
West, “The Effect of Acid on Superconformal Filling in 100 nm Trenches,” J. Vacuum Science and Technology B, 27, 2200 (2009).
116. Joshua W. Gallaway, Mark J. Willey, and Alan C. West,
“Copper Filling of 100 nm Trenches
using PEG, PPG, and a Triblock Copolymer as Plating Suppressors,” J. Electrochem. Soc., 156, D287
(2009).
115. Kristin
G. Shattuck and Alan C. West,
“An Investigation of Phosphate Based ECMP Electrolyte Performance on
Feature Scale Planarization,” J. Appl.
Electrochem.,39, 1719 (2009)
114. Joshua W. Gallaway, Mark J.
Willey, and Alan C. West, “Acceleration
Kinetics of PEG, PPG, and a Triblock Copolymer by SPS during Copper
Electroplating,” J. Electrochem.
Soc., 156, D146 (2009).
113. Ugur
Emekli and Alan C. West, “Effect of Additives and Pulse Plating on Copper
Nucleation onto Ru,” Electrochimica Acta,
54, 1177 (2009).
112. Xiaojun
J. Chen, Alan C. West, Donald M. Cropek, Scott Banta, “Fundamental Studies on
the Detection of the Superoxide Radical Using Various Alkanethiol Monolayers
and Immobilized Cytochrome C,” Anal.
Chem., 80, 9622 (2008).
111. Alan C.
West and Robert J. von Gutfeld, “Electrodeposition onto Oxide-Coated
Substrates,” ECS Transactions, 16
(13), 59 (2008).
110. Owen
Crowther and Alan C. West, “Effect of Electrolyte Composition on Lithium
Dendrite Growth,” J. Electrochem. Soc.,
155, A806 (2008).
109. Joshua
W. Gallaway and Alan C. West, “PEG, PPG, and Their Triblock Copolymers as
Suppressors in Copper Electroplating,” J.
Electrochem. Soc., 155 , D632 (2008).
108. Robert
von Gutfeld and Alan C. West, “In Situ Oxide Removal from Aluminum by Laser
Pulses Followed by Electroplating,” Electrochemical
and Solid State Letters, 11, D65
(2008).
107. Kristin
G. Shattuck, Jeng-Yu Lin, Paula Cojocaru, Alan C. West, “Characterization of
Phosphate Electrolytes for Use in Cu Electrochemical Mechanical Planarization,”
Electrochimica Acta, 53, 8211 (2008).
106. Alonso
Lozano-Morales, Heather McCrabb, E. Jennings Taylor, Alan
C. West, “Variation of Counterelectrode Size to Control Current Distribution in
Parallel Plate Cells,” J. Appl. Surface
Finishing, p. 34 (March, 2008).
105. Jeng-Yu
Lin, Alan C. West, and Chi-Chao Wan, “Adsorption and Desorption Studies of
Glycine and Benzotriazole during Cu Oxidation in a Chemical Mechanical
Polishing Bath,” J. Electrochem. Soc,
155, H396 (2008).
104. Robert Bozic, Alan C. West, and Rastislav Levicky,
“Square Wave Voltammetric Detection of 2,4,6-Trinitro-Toluene and
2,4-Dinitro-Toluene on a Gold Electrode Modified with Self Assembled
Monolayers,” Sensors and Actuators B, 133, 509 (2008).
103. Jeng-Yu Lin, Alan C. West, and Chi-Chao Wan, Yung-Yun
Wang “Evaluation of Post-Cu CMP Cleaning of Organic Residues Using Microfluidic
Device,” Electrochemistry Communications, 10, 677 (2008).
102. Mark J. Willey, Ugur Emekli, and Alan
C. West, “Uniformity Effects when Electrodepositing Cu onto Resistive
Substrates in the Presence of Organic Additives ,” J. Electrochem. Soc., 155, D302 (2008).
101. R. J. von
Gutfeld and Alan C. West, “Copper Plating on Titanium Alloy 6-2-4-2 using an in
situ High Voltage Pulse Followed by Plate-up,” J. Applied Electrochemistry, 38,
531 (2008).
100. Jennifer
L. Wade, Klaus S. Lackner, Alan C. West, “Transport Model for a High
Temperature, Mixed Conducting CO2 Separation Membrane,” Solid State Ionics, 178, 1530 (2007).
99. Mark
J. Willey and Alan C. West, “Nucleation on Resistive Substrates: Analysis of
Effect on Film Uniformity,”
Electrochimica Acta, 52, 6484
(2007).
98. R. J. von Gutfeld and Alan C. West, “Voltage Oxide
Removal for Plating: A New Method of Electroplating Oxide Coated Metals in situ.” J. Vacuum Science and Technology A, 25, 319 (2007).
97. Mark J. Willey, Jon Reid, and Alan C. West, “Adsorption
Kinetics of Polyvinylpyrrolidone during Copper Electrodeposition,” Electrochemical and Solid State Letter,
10, D38 (2007).
96. Mark J. Willey and Alan C. West, “SPS Adsorption and
Desorption during Copper Electrodeposition and its Impact on PEG Adsorption,” J. Electrochem. Soc., 154, D156 (2007).
95. Mark J. Willey and Alan C. West, “Microfluidic Studies of Adsorption and Desorption of
Polyethylene Glycol during Copper Electrodeposition,” J. Electrochem. Soc., 153,
C728 (2006).
94. P. Grace Chao, Alan C. West,
Clark T. Hung “Chondrocyte Intracellular Calcium, Cytoskeletal Organization and
Gene Expression Responses to Dynamic Osmotic Loading,” American Journal of Physiology- Cell Physiology, 291, C718 (2006).
93. Mark J. Willey and Alan C. West, “A Microfluidic
Device to Measure Electrode Response to Changes in Electrolyte Composition,” Electrochemical and Solid State Letters,
9, E17 (2006).
92.
Bulent M. Basol and Alan C. West, “Study on Mechanically Induced Suppression
and Super Filling Mechanisms,” Electrochemical
and Solid State Letters, 9,
C77 (2006).
91.
Alan C. West, Ingrid Shao, Hariklia Deligianni,”Numerical Simulation of Electrochemical
Planarization of Copper Overburden,” J.
Electrochem. Soc., 152, C652
(2005).
90. Min Zheng, Mark Willey and Alan C. West,
”Electrochemical Nucleation of Copper on Ruthenium: Effect of Cl-,
PEG and SPS,” Electrochemical and Solid
State Letters, 8, C151 (2005).
89. Jong-Min Lee and Alan C. West, “Impact of Pulse
Parameters on Current Distribution in High Aspect Ratio Vias and Through-Holes,
J. Electrochem. Soc., 152, C645 (2005).
88. Preethi Pratap, Allen Hunter, and
Alan West, “Remote Instrumentation,” in Invention
and Impact: Building Excellence in Undergraduate STEM Education, AAAS,
Washington (2005).
87. R. Betti, A. C. West, G.
Vermaas, and Y.Cao, “Corrosion and Embrittlement in High-Strength Wires of
Suspension Bridge Cables,” ASCE J. Bridge
Engineering, 151, (March/April
2005).
86. Alan C. West, Panos Andricacos, and
Lili Deligianni “Electrochemical Polishing of Metallization,” IBM J. Res. Devel., 49, 37 (2005).
85. P. Grace Chao, Zhongliang
Tang, Elsa Angelini, Alan C. West, Kevin D. Costa, Clark T. Hung, “Dynamic
Osmotic Loading of Cells Using a Novel Microfluidic Device,” Journal of Biomechanics, 38, 1273 ( 2005).
84. Min Zheng, Mark Willey, Hongyu
Song, and Alan C. West, “Copper Electrodeposition onto Titanium and Other
Substrates: Effect of Bath Composition,” Electrochemical
Society Proceedings, edited by L. Deligianni et al., Electrochemical Society, Pennington, NJ (2004).
83. Edward F. Leonard, Alan C. West,
Nina C. Shapley, and Mona U. Larsen, “Dialysis without Membranes: How and Why,”
Blood Purification, 22, 92 (2004).
82. Min Zheng and Alan C. West,
“Simulation of the Influence of Reactant Depletion on Nucleation Rate in
Electrodeposition,” J. Electrochem. Soc.,
151, C502 (2004).
81. Jong-Min Lee, John. T. Hachman, James J. Kelly, and Alan C. West,
“Improvement of Current Distribution on Substrates for MicroElectroMechanical
Systems,” J. Microlithography, Microfabrication, and Microsystems, 3, 146 (2004).
80. Yang Cao, G.W. Vermaas, R.
Betti, A.C. West, P.F. Duby, “Corrosion and Degradation of High-Strength Steel
Bridge Wire,” Corrosion, 59, 547 (2003).
79. Yang Cao, Jong-Min Lee, and
Alan C. West, “Designs for Minimizing Resistive Substrate Effects on Wafer
Metallization,” Plating and Surface
Finishing, 90(11), 40 (November,
2003).
78. Zhongliang Tang, Grace Chao,
Aurea Tucay, Erica Takai, Djordje Djukic, Mary Laura Lind, Clark Hung, Edward
Guo, Alan West, Richard Osgood, and James T. Yardley, “XYZ on a Chip: Nanoscale
Fabrication, Fluidics, and Optics Directed toward Applications within Biology
and Medicine,” in Organic Nanophotonics,
F. Charra et al, Editors, Kluwer Academic Publishers, Amsterdam (2003).
77. Aleksandar Radisic, Yang Cao, Premratn Taephaisitphongse, Alan C. West,
and Peter C. Searson, “Direct Copper Electrodeposition on TaN Barrier Layer,” J. Electrochem. Soc., 150, C362 (2003).
76. Zhongliang Tang, Seungbae Hong,
Djordje Djukic, Vijay Modi, Alan C. West, James Yardley, and
Richard M. Osgood, “Electrokinetic Flow Control for Composition Modulation in a
Microchannel,” J. Micromechanics and
Microengineering, 12(6), 870
(2002).
75. Seungbae Hong, Zhongliang Tang, Djordje Djukic, Aurea
Tucay, Sasha Bakhru, Richard
Osgood, James Yardley, Alan C. West, and Vijay Modi, “Simulation and
Experimental Validation of Electroosmotic Flow in a Microfluidic Channel,” Proceedings
of the 7th IEEE Conference on MEMS (2002).
74. Yang Cao and Alan C. West, “Nucleation and
Three-Dimensional Growth: Deviation from Diffusion Control,” J. Electrochem. Soc., 149, C223 (2002).
73. Radek Chalupa, Yang Cao, and Alan C. West, “Unsteady
Diffusion Effects in Electrodeposition in Submicron Features,” J. Applied Electrochem., 32, 135 (2002).
72. Aleksandar Radisic, Alan C. West, and Peter C.
Searson, “Influence of Additives on Nucleation and Growth of Copper on
n-Si(111) from Acidic Sulfate Solutions,” J.
Electrochem. Soc, 149, C94
(2002).
71. Yang Cao and Alan C. West, “Direct Numerical
Simulation of Nucleation and Three-Dimensional, Diffusion-Controlled Growth on
Microelectrodes,” J. Electroanalytical
Chem., 514, 103 (2001).
70. Alan C. West, Steven Mayer, and Jonathan Reid,
“A Superfilling Model that Predicts Bump Formation,” Electrochemical and Solid State Letters, 4, C50 (2001).
69. S.
Calabrese Barton, T. Patterson, E. Wang, T. F. Fuller, and A. C. West,
“Mixed-Reactant, Strip-Cell Direct Methanol Fuel Cells,” J. Power Sources, 96/2, 329 (2001).
68. Yang Cao, Premratn
Taephaisitphongse, Radek Chalupa, Alan C. West, “A Three-Additive Model of Superfilling of Copper,” J. Electrochem. Soc, 148, C466
(2001).
67. Premratn
Taephaisitphongse, Yang Cao, Alan West , “Electrochemical and Fill
Studies of a Multi-Component Additive Package for Copper Deposition,” J. Electrochem. Soc, 148, C492
(2001).
66. Jonathon E. Spanier, Alan C. West, and Irving P.
Herman, “Electrochemical Impedance Spectroscopy of 6H-SiC in Aqueous
Hydrofluoric Acid,” J. Electrochem. Soc,
148, C663 (2001).
65. Yang Cao, Peter Searson, and Alan C. West, “Direct
Numerical Simulation of Nucleation and Three-Dimensional, Diffusion-Controlled
Growth,” J. Electrochem. Soc., 148,
C376 (2001).
64. S. Calabrese Barton and A. C. West,
“Electrodissolution of Zinc at the Limiting Current,” J. Electrochem. Soc., 148, A490 (2001).
63. S. Calabrese Barton and A. C. West,
“Electrohydrodynamic Impedance in the Presence of Nonuniform Transport
Properties,” J. Electrochem. Soc., 148,
A381 (2001).
62. Radek Chalupa, Mingyong Chen, Vijay
Modi, and Alan C. West, “Limiting Current Density on a Line Electrode in
Impinging Slot Jet Flows,” J.
Electrochem. Soc., 148, E92 (2001).
61. Radek Chalupa. Mingyoung Chen, Vijay Modi, and Alan C.
West, “High Schmidt Mass Transfer in Turbulent Slot Jet Flows,” Int. J. Heat and Mass Transfer, 44,
3775 (2001).
60. Vijay Modi and Alan C. West, “Mass Transfer Problems in Electrochemical Systems,” Proceedings
of the Fourth ISHMT-ASME Heat and Mass Transfer Conference, 117 (2000).
59. Mingyoung Chen, Radek Chalupa, Alan C. West, and Vijay
Modi, “High Schmidt Number Mass Transfer in Laminar Slot Jet Flows,” Int. J. Heat and Mass Transfer, 43, 3907 (2000).
58.
Alan C. West, “Theory of Filling of High-Aspect Ratio Trenches and Vias in
Presence of Additives,” J. Electrochem.
Soc., 147, 227
(2000).
57. S.
Calabrese Barton, Garry W. Vermaas, Paul F. Duby, Alan C. West, and Raimondo
Betti, “Accelerated Corrosion and Embrittlement of High-Strength Bridge Wire,” Journal of Materials in Civil Engineering,
12, 33
(2000).
56.
James J. Kelly and Alan C. West , “Experimental and Numerical Study of Leveling
of Submicron Features by Organic Additives,” in Electrochemical Processing in
ULSI Fabrication and Semiconductor/Metal Deposition II,” edited by P.C.
Andricacos, et al., PV 99-9,
Electrochemical Society, Pennington, NJ (1999).
55. Alan C. West, Ahmed Shehata, and Vijay Modi,
”Mathematical Modeling of Electrodeposition Processes for ULSI
Copper-Interconect Technology” in Tutorials
in Electochemical Engineering-Mathematical Modeling, edited by R. V.
Savinell, A. C. West, J. M. Fenton, and H. Wiedner, PV 99-14, Electrochemical
Society, Pennington, NJ (1999).
54. James J. Kelly and Alan C.
West, “Leveling of 200-nm Features by Organic Additives,” Electrochemical and Solid State Letters, 2, 561 (1999).
53. James J. Kelly, Chunyan Tian,
and Alan C. West, “Leveling and Microstructural Effects of Additives for Copper
Electrodeposition,” J. Electrochem. Soc.,
146, 2540 (1999).
52. S. Calabrese Barton, T.
Patterson, E. Wang, T. F. Fuller, and Alan C. West, “Electrode Performance and
Design for Strip-Cell Direct Methanol Fuel Cells,” in Proton Conducting Membrane Fuel Cells (2nd International Symposium), edited
by S. Gottesfeld, T. F. Fuller, G. Halpert, PV 98-27, Electrochemical Society,
Pennington, NJ (1999).
51. Brett C. Baker and Alan C. West, “A Flow Modulation
Study of Nickel-Iron Codeposition,” Electrochimica
Acta, 44, 1567 (1999).
50. James J. Kelly and Alan C. West, "Design Tools for
Electrodeposition in the Presence of Additives," Electrochemical Processing in ULSI Fabrication I and Interconnect and
Contact Metallization, edited by P. Andricacos et al., PV 98-6, Electrochemical Society, Pennington, NJ (1999).
49. J.
Deliang Yang, Vijay Modi, and Alan C. West, “Analysis of Mass Transfer and
Fluid Flow for Electrochemical Processes,” Modern
Aspects of Electrochemistry, 32,
edited by B. E. Conway et al.,
(1999).
48. Ahmed Shehata, J. Deliang Yang, Alan C. West, and
Vijay Modi, “Effect of an Unsteady External Flow on Mass Transfer to Cavities,”
Int. J. Heat and Mass Transfer, 42, 673 (1999).
47. Roberto Vidal and Alan C. West, “Aluminum and Aluminum
Alloy Dissolution in Concentrated Phosphoric Acid,” J. Electrochem. Soc., 145,
4067 (1998).
46. Scott A. Calabrese Barton,
Bryan L. Murach, Thomas F. Fuller, and Alan C. West, “A Methanol Sensor for
Portable, Direct Methanol Fuel Cells,” J.
Electrochem. Soc., 145, 3783
(1998).
45. James J. Kelly, Christopher J. Durning, and Alan C.
West, “Effect of Current Distribution on Quartz Crystal Microbalance
Measurements,” Mat. Res. Soc. Symp.
Proc., 502, 145 (1998).
44. James J. Kelly and Alan C.
West, “Copper Deposition in the Presence of Polyethylene Glycol. 2. Electrochemical Impedance
Spectroscopy Study,” J. Electrochem. Soc.,
145, 3477 (1998).
43. James J. Kelly and Alan C.
West, “Copper Deposition in the Presence of Polyethylene Glycol. 1. Quartz Crystal Microbalance Study,” J. Electrochem. Soc., 145, 3472 (1998).
42. Alan C. West, Chin-Chang Cheng, and Brett C. Baker,
“Pulse Reverse Copper Electrodeposition in High Aspect Ratio Trenches and
Vias,” J. Electrochem. Soc., 145, 3070 (1998).
41. Qian Chen, Vijay Modi, and Alan C. West, “The
Influence of Fluid Flow on Leveling,” J.
Applied Electrochemistry, 28,
579 (1998).
40. Alan C. West and Stephen J.
Lombardo, “The Role of Thermal and Transport Properties on the Binder Burnout
of Injection Molded Ceramic Components," Chemical Engineering Journal, 71,
243 (1998).
39. Tamer Wasfy, Alan C. West, and
Vijay Modi, “Parallel Finite Element Computation of Unsteady Incompressible
Flows,” Int. J. Numerical Methods in
Fluids, 26, 17 (1998).
38. Chin-Chang Cheng and Alan C. West, “Flow Modulation
for Studies of Leveling Agents,” J.
Electrochem. Soc., 145, 560
(1998).
37. James J. Kelly, K. M. Anisur Rahman, Christopher J.
Durning, and Alan C. West, “Effect of Current Distribution on Quartz Crystal
Microbalance Measurements,” J.
Electrochem. Soc., 145, 492
(1998).
36. Phillipe Desprez, Michael
Matlosz, J. Deliang Yang, and Alan C. West, “Estimation of Front
Velocity in Electrodeposition onto Highly Resistive Substrates,” J. Electrochem. Soc., 145, 165 (1998).
35. R. Betti. M. P. Bieniek, P. F.
Duby, A. C. West, S. C. Barton, and G. Vermaas, “Accelerated Corrosion and
Hydrogen Embrittlement Tests on High Strength Bridge Wires,” in Recent Advances in Bridge Engineering:
Advanced Rehabilitation, Durable Materials, Nondestructive Evaluation and
Management, U. Meier and R. Betti, Eds. Columbia University, New York
(1997).
34. J. Deliang Yang, Ahmed
Shehata, Vijay Modi, and Alan C. West, “Mass Transfer to a Channel Wall
Downstream of a Cylinder,” Int. J. Heat
and Mass Transfer, 40, 4263
(1997).
33. Chin-Chang Cheng and Alan C.
West, “Nickel Deposition in the Presence of Coumarin: An Electrochemical
Impedance Spectroscopy Study,” J.
Electrochem. Soc., 144, 3050
(1997).
32. J. Deliang Yang and Alan C.
West, “Current Distributions Governed by Coupled Concentration and Potential
Fields,” AIChE Journal, 43, 811 (1997).
31. Brett C. Baker and Alan C.
West, “Electrochemical Impedance
Spectroscopy Study of Nickel-Iron Deposition. 2. Theoretical
Interpretation,” J. Electrochem. Soc.,
144, 169 (1997).
30. Brett C. Baker and Alan C.
West, “Electrochemical Impedance
Spectroscopy Study of Nickel-Iron Deposition. 1. Experimental
Results,” J. Electrochem. Soc., 144, 164 (1997).
29. Roberto Vidal and Alan C.
West, “High Rate Dissolution of Copper in Cupric-Sulfate Electrolytes,” Electrochimica Acta, 41, 2417 (1996).
28. Alan C. West and Thomas F.
Fuller, “The Influence of Rib Spacing in Proton-Exchange Membrane Electrode
Assemblies," J. Appl. Electrochem.,
26, 557 (1996).
27. Benoit DeBecker and Alan C.
West, "Workpiece, Pattern, and Feature-Scale Current Distributions," J. Electrochem. Soc., 143, 486 (1996).
26. Roberto Vidal and Alan C.
West, "An Electrochemical Study of Copper Electropolishing in Concentrated
Phosphoric Acid," Electrochemical
Microfabrication, edited by Madhav Datta et al., Electrochemical Society, Pennington, NJ (1995).
25. Benoit DeBecker, Deliang Yang,
Paul Duby, Vijay Modi, and Alan C. West, "Mass-transfer-Limited Current
Distributions on Electrode Arrays in Presence of a Shear Flow," J. Electrochem. Soc., 142, 3413 (1995).
24. Benoit DeBecker, Paul Duby,
Vijay Modi, and Alan C. West, "Mass Transfer to a Line Electrode in Presence
of Periodic Fluid Flow," J.
Electrochem. Soc., 142, 3001
(1995).
23. Alan C. West, Benoit DeBecker,
and Deliang Yang, "The Simulation of Mass-Transfer Effects in
Electrochemical Systems," in Fundamentals
of Electrochemical Process Design: A Tutorial, edited by Jan B. Talbot and
James Fenton, PV 95-11, Electrochemistry Society, Pennington, NJ (1995).
22. Roberto Vidal and Alan C.
West, "Copper Electropolishing in Concentrated Phosphoric Acid. II.
Theoretical Interpretation," J.
Electrochem. Soc., 142, 2689
(1995).
21. Roberto Vidal and Alan C.
West, "Copper Electropolishing in Concentrated Phosphoric Acid. I.
Experiment Findings," J.
Electrochem. Soc., 142, 2682
(1995).
20. Xiaodong Wang, Vijay Modi, and
Alan C. West, "Limiting Current Density in Presence of Tangential,
Oscillating Fluid Flow," J.
Electrochem. Soc., 141, 2753
(1994).
19. Roberto Vidal, Paul Duby, and
Alan C. West, "A Mathematical Model of Ionic Transport in a Porous
Diaphragm of a Chrome-Alum Cell," Metallurgical
and Materials Transactions B, 25(3),
351 (1994).
18. Alan C. West and Michael
Matlosz, "A Boundary-Element Method for Transient Diffusion," J. Applied Electrochemistry, 24, 261 (1994).
17. Roberto Vidal, Paul Duby, and
Alan C. West, "Transport and Chemistry Within the Separator of a
Chrome-Alum Electrowinning Process" in EPD
Congress 1994, G. W. Warren, editor, The Minerals, Metals, and Materials
Society, Warrendale, Pennsylvania (1994).
16. Alan C. West, "Comparison
of Modeling Approaches for a Porous Salt Film," J. Electrochem. Soc., 140,
403 (1993).
15. Alan C. West, "Ohmic Interactions Within Electrode Ensembles,"
J. Electrochem. Soc., 140, 134 (1993).
14. A. C. West, C. Madore, M.
Matlosz, and D. Landolt, "Shape Changes During Through-Mask
Electrochemical Etching of Thin Metal Films," Electrochemical Microfabrication, edited by Madhav Datta et al., PV 92-3, Electrochemistry
Society, Pennington, NJ (1992).
13. A. C. West, R.-D. Grimm, D.
Landolt, C. Deslouis, and B. Tribollet, "Electrohydrodynamic Impedance
Study of Anodically Formed Salt Films on Iron in Chloride Solutions," J. Electroanalytical Chem., 330,
693 (1992).
12. R.-D. Grimm, A. C. West and D.
Landolt, "AC Impedance Study of Anodically Formed Salt Films on Iron in Chloride
Solutions," J. Electrochem. Soc.,
139, 1622 (1992).
11. Alan C. West, Michael Matlosz,
and D. Landolt, "Primary Current Distribution in the Hull Cell and Related
Trapezoidal Geometries," J. Applied
Electrochemistry, 22, 301
(1992).
10. M. Matlosz, P.-H. Valloton, A.
C. West, and D. Landolt, "Nonuniform Current Distribution and Thickness
during Deposition onto Resistive Substrates," J. Electrochem. Soc., 139,
752 (1992).
9. A. C. West, C. Madore, M.
Matlosz, and D. Landolt, "Shape Changes During Through-Mask
Electrochemical Micromachining of Thin Metal Films," J. Electrochem. Soc., 139,
499 (1992).
8. C. Madore, A. C. West, M.
Matlosz, and D. Landolt, "Design Considerations for a Cylindrical Hull
Cell with Forced Convection," Electrochimica
Acta, 37, 69 (1992).
7. Alan C. West and John Newman, "Determining Current
Distributions Governed by Laplace's Equation," Modern Aspects of Electrochemistry ,23, edited by B. E. Conway et
al. (1992).
6. Alan C. West and John Newman,
"Current Distributions on Recessed Electrodes," J. Electrochem. Soc., 138, 1620 (1991).
5. Alan C. West, Michael Matlosz,
and D. Landolt, "Normalized and Average Current Distributions on Unevenly
Spaced Patterns," J. Electrochem.
Soc., 138, 728 (1991).
4. Alan C. West, Johannes H.
Sukamto, and John Newman, "A Criterion to Verify Current Distribution Calculations,"
J. Electrochem. Soc., 137, 2745 (1990).
3. Alan C. West and John Newman,
"Interpretation of Kinetic Rate Data Taken in a Channel Flow Cell," J. Electrochem. Soc., 136, 3755 (1989).
2. Alan C. West and John Newman, "Current Distribution
Near an Electrode Edge as a Primary Distribution is Approached," J. Electrochem. Soc., 136, 2935 (1989).
1. Alan C. West and John Newman,
"Corrections to Kinetic Measurements Taken on a Disk Electrode," J. Electrochem. Soc., 136, 139 (1989).
PATENTS
1. John T. Hachman, James J.
Kelly, and Alan C. West, “Apparatus and Method for Controlling Plating
Uniformity,” U.S. Patent No. 6802950 (2004).
2. E. F. Leonard, Z. Tang, A. C.
West, and N. Shapley, “Systems and Methods of Blood-Based Therapies Having a
Microfluidic Membraneless Exchange Device,” U.S. Patent application Number 20040225249 (2004).
3. E. I. Cooper, H. Deligianni, P.
Andricacos, B.S. Haran, M. Krishnan, J. M. Cotte, L. Economikos, D. F.
Canaperi, E. G. Walton, S. Franz, A. P. Mansson, and A. C. West, “Methods and
Compositions for Electro-Chemical-Mechanical Polishing,” U.S. and International
Patent Application (2004).
4. Robert J. von Gutfeld and Alan C. West, “In Situ
Plating and Etching of Materials Covered with a Surface Film,” U.S. Patent
Application (2006).
5. Robert J. von Gutfeld and Alan C. West, “Systems and
Methods for Anisotropic Etching,” U.S. Patent Application (2006).
6. Alan C. West, Mark Willey, and
Robert J. von Gutfeld, “Systems and Methods for Monitoring Plating Baths,” U.S.
Patent Application (2006).
7. Alan C. West and Mark Willey, “Systems and Methods for
Screening Plating Baths,” U.S. Provisional Patent Application (2006).