PUBLICATIONS

 

 

111.  Ugur Emekli and Alan C. West, “Effect of Additives and Pulse Plating on Copper Nucleation onto Ru,” Electrochimica Acta, in press (2008).

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110.  Owen Crowther and Alan C. West, “Effect of Electrolyte Composition on Lithium Dendrite Growth,” J. Electrochem. Soc., 155, A806 (2008).

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109.  Joshua W. Gallaway and Alan C. West, “PEG, PPG, and Their Triblock Copolymers as Suppressors in Copper Electroplating,” J. Electrochem. Soc., 155 , D632 (2008).

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108.  Robert von Gutfeld and Alan C. West, “In Situ Oxide Removal from Aluminum by Laser Pulses Followed by Electroplating,” Electrochemical and Solid State Letters, 11, D65 (2008).

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107.  Kristin G. Shattuck, Jeng-Yu Lin, Paula Cojocaru, Alan C. West, “Characterization of Phosphate Electrolytes for Use in Cu Electrochemical Mechanical Planarization,” Electrochimica Acta, 53, 8211 (2008).

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106.  Alonso Lozano-Morales, Heather McCrabb, E. Jennings Taylor, Alan C. West, “Variation of Counterelectrode Size to Control Current Distribution in Parallel Plate Cells,” J. Appl. Surface Finishing, p. 34 (March, 2008).

 

105.  Jeng-Yu Lin, Alan C. West, and Chi-Chao Wan, “Adsorption and Desorption Studies of Glycine and Benzotriazole during Cu Oxidation in a Chemical Mechanical Polishing Bath,” J. Electrochem. Soc, 155, H396 (2008).

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104. Robert Bozic, Alan C. West, and Rastislav Levicky, “Square Wave Voltammetric Detection of 2,4,6-Trinitro-Toluene and 2,4-Dinitro-Toluene on a Gold Electrode Modified with Self Assembled Monolayers,” Sensors and Actuators B, 133, 509 (2008).

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103. Jeng-Yu Lin, Alan C. West, and Chi-Chao Wan, Yung-Yun Wang “Evaluation of Post-Cu CMP Cleaning of Organic Residues Using Microfluidic Device,” Electrochemistry Communications, 10, 677 (2008).

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102.  Mark J. Willey, Ugur Emekli, and Alan C. West, “Uniformity Effects when Electrodepositing Cu onto Resistive Substrates in the Presence of Organic Additives ,” J. Electrochem. Soc., 155, D302 (2008).

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101.  R. J. von Gutfeld and Alan C. West, “Copper Plating on Titanium Alloy 6-2-4-2 using an in situ High Voltage Pulse Followed by Plate-up,” J. Applied Electrochemistry, 38, 531 (2008).

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100.  Jennifer L. Wade, Klaus S. Lackner, Alan C. West, “Transport Model for a High Temperature, Mixed Conducting CO2 Separation Membrane,” Solid State Ionics, 178, 1530 (2007).

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99. Mark J. Willey and Alan C. West, “Nucleation on Resistive Substrates: Analysis of Effect on Film Uniformity,” Electrochimica Acta, 52, 6484 (2007).

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98. R. J. von Gutfeld and Alan C. West, “Voltage Oxide Removal for Plating: A New Method of Electroplating Oxide Coated Metals in situ.” J. Vacuum Science and Technology A, 25, 319 (2007).

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97. Mark J. Willey, Jon Reid, and Alan C. West, “Adsorption Kinetics of Polyvinylpyrrolidone during Copper Electrodeposition,” Electrochemical and Solid State Letter, 10, D38 (2007).

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96. Mark J. Willey and Alan C. West, “SPS Adsorption and Desorption during Copper Electrodeposition and its Impact on PEG Adsorption,” J. Electrochem. Soc., 154, D156 (2007).

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95. Mark J. Willey and Alan C. West, “Microfluidic Studies of Adsorption and Desorption of Polyethylene Glycol during Copper Electrodeposition,” J. Electrochem. Soc., 153, C728 (2006).

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94. P. Grace Chao, Alan C. West, Clark T. Hung “Chondrocyte Intracellular Calcium, Cytoskeletal Organization and Gene Expression Responses to Dynamic Osmotic Loading,” American Journal of Physiology- Cell Physiology, 291, C718 (2006).

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93. Mark J. Willey and Alan C. West, “A Microfluidic Device to Measure Electrode Response to Changes in Electrolyte Composition,” Electrochemical and Solid State Letters, 9, E17 (2006).

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92. Bulent M. Basol and Alan C. West, “Study on Mechanically Induced Suppression and Super Filling Mechanisms,” Electrochemical and Solid State Letters, 9, C77 (2006).

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91. Alan C. West, Ingrid Shao, Hariklia Deligianni,”Numerical Simulation of Electrochemical Planarization of Copper Overburden,” J. Electrochem. Soc., 152, C652 (2005).

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90. Min Zheng, Mark Willey and Alan C. West, ”Electrochemical Nucleation of Copper on Ruthenium: Effect of Cl-, PEG and SPS,” Electrochemical and Solid State Letters, 8, C151 (2005).

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89. Jong-Min Lee and Alan C. West, “Impact of Pulse Parameters on Current Distribution in High Aspect Ratio Vias and Through-Holes, J. Electrochem. Soc., 152, C645 (2005).

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88. Preethi Pratap, Allen Hunter, and Alan West, “Remote Instrumentation,” in Invention and Impact: Building Excellence in Undergraduate STEM Education, AAAS, Washington (2005).

 

87. R. Betti, A. C. West, G. Vermaas, and Y.Cao, “Corrosion and Embrittlement in High-Strength Wires of Suspension Bridge Cables,” ASCE J. Bridge Engineering, 151, (March/April 2005).

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86. Alan C. West, Panos Andricacos, and Lili Deligianni “Electrochemical Polishing of Metallization,” IBM J. Res. Devel., 49, 37 (2005).

 

85. P. Grace Chao, Zhongliang Tang, Elsa Angelini, Alan C. West, Kevin D. Costa, Clark T. Hung, “Dynamic Osmotic Loading of Cells Using a Novel Microfluidic Device,” Journal of Biomechanics, 38, 1273 ( 2005). 

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84. Min Zheng, Mark Willey, Hongyu Song, and Alan C. West, “Copper Electrodeposition onto Titanium and Other Substrates: Effect of Bath Composition,” Electrochemical Society Proceedings, edited by L. Deligianni et al., Electrochemical Society, Pennington, NJ (2004).

 

83. Edward F. Leonard, Alan C. West, Nina C. Shapley, and Mona U. Larsen, “Dialysis without Membranes: How and Why,” Blood Purification, 22, 92 (2004).

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82. Min Zheng and Alan C. West, “Simulation of the Influence of Reactant Depletion on Nucleation Rate in Electrodeposition,” J. Electrochem. Soc., 151, C502 (2004).

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81. Jong-Min Lee, John. T. Hachman, James J. Kelly, and Alan C. West, “Improvement of Current Distribution on Substrates for MicroElectroMechanical Systems,” J. Microlithography, Microfabrication, and Microsystems, 3, 146 (2004).

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80. Yang Cao, G.W. Vermaas, R. Betti, A.C. West, P.F. Duby, “Corrosion and Degradation of High-Strength Steel Bridge Wire,” Corrosion, 59, 547 (2003).

 

79. Yang Cao, Jong-Min Lee, and Alan C. West, “Designs for Minimizing Resistive Substrate Effects on Wafer Metallization,” Plating and Surface Finishing, 90(11), 40 (November, 2003).

 

78. Zhongliang Tang, Grace Chao, Aurea Tucay, Erica Takai, Djordje Djukic, Mary Laura Lind, Clark Hung, Edward Guo, Alan West, Richard Osgood, and James T. Yardley, “XYZ on a Chip: Nanoscale Fabrication, Fluidics, and Optics Directed toward Applications within Biology and Medicine,” in Organic Nanophotonics, F. Charra et al, Editors, Kluwer Academic Publishers, Amsterdam (2003).

 

77. Aleksandar Radisic, Yang Cao, Premratn Taephaisitphongse, Alan C. West, and Peter C. Searson, “Direct Copper Electrodeposition on TaN Barrier Layer,” J. Electrochem. Soc., 150, C362 (2003).

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76. Zhongliang Tang, Seungbae Hong, Djordje Djukic, Vijay Modi, Alan C. West, James Yardley, and Richard M. Osgood, “Electrokinetic Flow Control for Composition Modulation in a Microchannel,” J. Micromechanics and Microengineering, 12(6), 870 (2002).

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75. Seungbae Hong, Zhongliang Tang, Djordje Djukic, Aurea Tucay, Sasha Bakhru,  Richard Osgood, James Yardley, Alan C. West, and Vijay Modi, “Simulation and Experimental Validation of Electroosmotic Flow in a Microfluidic Channel,” Proceedings of the 7th IEEE Conference on MEMS (2002).

 

74. Yang Cao and Alan C. West, “Nucleation and Three-Dimensional Growth: Deviation from Diffusion Control,” J. Electrochem. Soc., 149, C223 (2002).

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73. Radek Chalupa, Yang Cao, and Alan C. West, “Unsteady Diffusion Effects in Electrodeposition in Submicron Features,” J. Applied Electrochem., 32, 135 (2002).

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72. Aleksandar Radisic, Alan C. West, and Peter C. Searson, “Influence of Additives on Nucleation and Growth of Copper on n-Si(111) from Acidic Sulfate Solutions,” J. Electrochem. Soc, 149, C94 (2002).

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71. Yang Cao and Alan C. West, “Direct Numerical Simulation of Nucleation and Three-Dimensional, Diffusion-Controlled Growth on Microelectrodes,” J. Electroanalytical Chem., 514, 103 (2001).

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70. Alan C. West, Steven Mayer, and Jonathan Reid, “A Superfilling Model that Predicts Bump Formation,” Electrochemical and Solid State Letters, 4, C50 (2001).

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69. S. Calabrese Barton, T. Patterson, E. Wang, T. F. Fuller, and A. C. West, “Mixed-Reactant, Strip-Cell Direct Methanol Fuel Cells,” J. Power Sources, 96/2, 329 (2001).

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68. Yang Cao, Premratn Taephaisitphongse, Radek Chalupa, Alan C. West, “A Three-Additive Model of Superfilling of Copper,” J. Electrochem. Soc, 148, C466 (2001).

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67. Premratn Taephaisitphongse, Yang Cao, Alan West , “Electrochemical and Fill Studies of a Multi-Component Additive Package for Copper Deposition,” J. Electrochem. Soc, 148, C492 (2001).

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66. Jonathon E. Spanier, Alan C. West, and Irving P. Herman, “Electrochemical Impedance Spectroscopy of 6H-SiC in Aqueous Hydrofluoric Acid,” J. Electrochem. Soc, 148, C663 (2001).

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65. Yang Cao, Peter Searson, and Alan C. West, “Direct Numerical Simulation of Nucleation and Three-Dimensional, Diffusion-Controlled Growth,” J. Electrochem. Soc., 148, C376 (2001).

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64. S. Calabrese Barton and A. C. West, “Electrodissolution of Zinc at the Limiting Current,” J. Electrochem. Soc., 148, A490 (2001).

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63. S. Calabrese Barton and A. C. West, “Electrohydrodynamic Impedance in the Presence of Nonuniform Transport Properties,” J. Electrochem. Soc., 148, A381 (2001).

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62. Radek Chalupa, Mingyong Chen, Vijay Modi, and Alan C. West, “Limiting Current Density on a Line Electrode in Impinging Slot Jet Flows,” J. Electrochem. Soc., 148, E92 (2001).

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61. Radek Chalupa. Mingyoung Chen, Vijay Modi, and Alan C. West, “High Schmidt Mass Transfer in Turbulent Slot Jet Flows,” Int. J. Heat and Mass Transfer, 44, 3775 (2001).

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60. Vijay Modi and Alan C. West, “Mass Transfer Problems in Electrochemical Systems,” Proceedings of the Fourth ISHMT-ASME Heat and Mass Transfer Conference, 117 (2000).

 

59. Mingyoung Chen, Radek Chalupa, Alan C. West, and Vijay Modi, “High Schmidt Number Mass Transfer in Laminar Slot Jet Flows,” Int. J. Heat and Mass Transfer, 43, 3907 (2000).

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58. Alan C. West, “Theory of Filling of High-Aspect Ratio Trenches and Vias in Presence of Additives,” J. Electrochem. Soc., 147, 227 (2000).

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57. S. Calabrese Barton, Garry W. Vermaas, Paul F. Duby, Alan C. West, and Raimondo Betti, “Accelerated Corrosion and Embrittlement of High-Strength Bridge Wire,” Journal of Materials in Civil Engineering, 12, 33 (2000).

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56. James J. Kelly and Alan C. West , “Experimental and Numerical Study of Leveling of Submicron Features by Organic Additives,” in Electrochemical Processing in ULSI Fabrication and Semiconductor/Metal Deposition II,” edited by P.C. Andricacos, et al., PV 99-9, Electrochemical Society, Pennington, NJ (1999).

 

55. Alan C. West, Ahmed Shehata, and Vijay Modi, ”Mathematical Modeling of Electrodeposition Processes for ULSI Copper-Interconect Technology” in Tutorials in Electochemical Engineering-Mathematical Modeling, edited by R. V. Savinell, A. C. West, J. M. Fenton, and H. Wiedner, PV 99-14, Electrochemical Society, Pennington, NJ (1999).

 

54. James J. Kelly and Alan C. West, “Leveling of 200-nm Features by Organic Additives,” Electrochemical and Solid State Letters, 2, 561 (1999).

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53. James J. Kelly, Chunyan Tian, and Alan C. West, “Leveling and Microstructural Effects of Additives for Copper Electrodeposition,” J. Electrochem. Soc., 146, 2540 (1999).

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52. S. Calabrese Barton, T. Patterson, E. Wang, T. F. Fuller, and Alan C. West, “Electrode Performance and Design for Strip-Cell Direct Methanol Fuel Cells,” in Proton Conducting Membrane Fuel Cells (2nd International Symposium), edited by S. Gottesfeld, T. F. Fuller, G. Halpert, PV 98-27, Electrochemical Society, Pennington, NJ (1999).

 

51. Brett C. Baker and Alan C. West, “A Flow Modulation Study of Nickel-Iron Codeposition,” Electrochimica Acta, 44, 1567 (1999).

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50. James J. Kelly and Alan C. West, "Design Tools for Electrodeposition in the Presence of Additives," Electrochemical Processing in ULSI Fabrication I and Interconnect and Contact Metallization, edited by P. Andricacos et al., PV 98-6, Electrochemical Society, Pennington, NJ (1999).

 

49.  J. Deliang Yang, Vijay Modi, and Alan C. West, “Analysis of Mass Transfer and Fluid Flow for Electrochemical Processes,” Modern Aspects of Electrochemistry, 32, edited by B. E. Conway et al., (1999).

 

48. Ahmed Shehata, J. Deliang Yang, Alan C. West, and Vijay Modi, “Effect of an Unsteady External Flow on Mass Transfer to Cavities,” Int. J. Heat and Mass Transfer, 42, 673 (1999).

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47. Roberto Vidal and Alan C. West, “Aluminum and Aluminum Alloy Dissolution in Concentrated Phosphoric Acid,” J. Electrochem. Soc., 145, 4067 (1998).

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46. Scott A. Calabrese Barton, Bryan L. Murach, Thomas F. Fuller, and Alan C. West, “A Methanol Sensor for Portable, Direct Methanol Fuel Cells,” J. Electrochem. Soc., 145, 3783 (1998).

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45. James J. Kelly, Christopher J. Durning, and Alan C. West, “Effect of Current Distribution on Quartz Crystal Microbalance Measurements,” Mat. Res. Soc. Symp. Proc., 502, 145 (1998).

 

44. James J. Kelly and Alan C. West, “Copper Deposition in the Presence of Polyethylene Glycol.  2. Electrochemical Impedance Spectroscopy Study,” J. Electrochem. Soc., 145, 3477 (1998).

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43. James J. Kelly and Alan C. West, “Copper Deposition in the Presence of Polyethylene Glycol.  1. Quartz Crystal Microbalance Study,” J. Electrochem. Soc., 145, 3472 (1998).

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42. Alan C. West, Chin-Chang Cheng, and Brett C. Baker, “Pulse Reverse Copper Electrodeposition in High Aspect Ratio Trenches and Vias,” J. Electrochem. Soc., 145, 3070 (1998).

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41. Qian Chen, Vijay Modi, and Alan C. West, “The Influence of Fluid Flow on Leveling,” J. Applied Electrochemistry, 28, 579 (1998).

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40. Alan C. West and Stephen J. Lombardo, “The Role of Thermal and Transport Properties on the Binder Burnout of Injection Molded Ceramic Components," Chemical Engineering Journal, 71, 243 (1998).

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39. Tamer Wasfy, Alan C. West, and Vijay Modi, “Parallel Finite Element Computation of Unsteady Incompressible Flows,” Int. J. Numerical Methods in Fluids, 26, 17 (1998).

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38. Chin-Chang Cheng and Alan C. West, “Flow Modulation for Studies of Leveling Agents,” J. Electrochem. Soc., 145, 560 (1998).

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37. James J. Kelly, K. M. Anisur Rahman, Christopher J. Durning, and Alan C. West, “Effect of Current Distribution on Quartz Crystal Microbalance Measurements,” J. Electrochem. Soc., 145, 492 (1998).

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36. Phillipe Desprez, Michael Matlosz, J. Deliang Yang, and Alan C. West, “Estimation of Front Velocity in Electrodeposition onto Highly Resistive Substrates,” J. Electrochem. Soc., 145, 165 (1998).

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35. R. Betti. M. P. Bieniek, P. F. Duby, A. C. West, S. C. Barton, and G. Vermaas, “Accelerated Corrosion and Hydrogen Embrittlement Tests on High Strength Bridge Wires,” in Recent Advances in Bridge Engineering: Advanced Rehabilitation, Durable Materials, Nondestructive Evaluation and Management, U. Meier and R. Betti, Eds. Columbia University, New York (1997).

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34. J. Deliang Yang, Ahmed Shehata, Vijay Modi, and Alan C. West, “Mass Transfer to a Channel Wall Downstream of a Cylinder,” Int. J. Heat and Mass Transfer, 40, 4263 (1997).

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33. Chin-Chang Cheng and Alan C. West, “Nickel Deposition in the Presence of Coumarin: An Electrochemical Impedance Spectroscopy Study,” J. Electrochem. Soc., 144, 3050 (1997).

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32. J. Deliang Yang and Alan C. West, “Current Distributions Governed by Coupled Concentration and Potential Fields,” AIChE Journal, 43, 811 (1997).

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31. Brett C. Baker and Alan C. West, “Electrochemical Impedance Spectroscopy Study of Nickel-Iron Deposition.  2.  Theoretical Interpretation,” J. Electrochem. Soc., 144, 169 (1997).

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30. Brett C. Baker and Alan C. West, “Electrochemical Impedance Spectroscopy Study of Nickel-Iron Deposition.  1.  Experimental Results,” J. Electrochem. Soc., 144, 164 (1997).

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29. Roberto Vidal and Alan C. West, “High Rate Dissolution of Copper in Cupric-Sulfate Electrolytes,” Electrochimica Acta, 41, 2417 (1996).

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28. Alan C. West and Thomas F. Fuller, “The Influence of Rib Spacing in Proton-Exchange Membrane Electrode Assemblies," J. Appl. Electrochem., 26, 557 (1996).

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27. Benoit DeBecker and Alan C. West, "Workpiece, Pattern, and Feature-Scale Current Distributions," J. Electrochem. Soc., 143, 486 (1996).

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26. Roberto Vidal and Alan C. West, "An Electrochemical Study of Copper Electropolishing in Concentrated Phosphoric Acid," Electrochemical Microfabrication, edited by Madhav Datta et al., Electrochemical Society, Pennington, NJ (1995).

 

25. Benoit DeBecker, Deliang Yang, Paul Duby, Vijay Modi, and Alan C. West, "Mass-transfer-Limited Current Distributions on Electrode Arrays in Presence of a Shear Flow," J. Electrochem. Soc., 142, 3413 (1995).

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24. Benoit DeBecker, Paul Duby, Vijay Modi, and Alan C. West, "Mass Transfer to a Line Electrode in Presence of Periodic Fluid Flow," J. Electrochem. Soc., 142, 3001 (1995).

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23. Alan C. West, Benoit DeBecker, and Deliang Yang, "The Simulation of Mass-Transfer Effects in Electrochemical Systems," in Fundamentals of Electrochemical Process Design: A Tutorial, edited by Jan B. Talbot and James Fenton, PV 95-11, Electrochemistry Society, Pennington, NJ (1995).

 

22. Roberto Vidal and Alan C. West, "Copper Electropolishing in Concentrated Phosphoric Acid. II. Theoretical Interpretation," J. Electrochem. Soc., 142, 2689 (1995).

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21. Roberto Vidal and Alan C. West, "Copper Electropolishing in Concentrated Phosphoric Acid. I. Experiment Findings," J. Electrochem. Soc., 142, 2682 (1995).

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20. Xiaodong Wang, Vijay Modi, and Alan C. West, "Limiting Current Density in Presence of Tangential, Oscillating Fluid Flow," J. Electrochem. Soc., 141, 2753 (1994).

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19. Roberto Vidal, Paul Duby, and Alan C. West, "A Mathematical Model of Ionic Transport in a Porous Diaphragm of a Chrome-Alum Cell," Metallurgical and Materials Transactions B, 25(3), 351 (1994).

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18. Alan C. West and Michael Matlosz, "A Boundary-Element Method for Transient Diffusion," J. Applied Electrochemistry, 24, 261 (1994).

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17. Roberto Vidal, Paul Duby, and Alan C. West, "Transport and Chemistry Within the Separator of a Chrome-Alum Electrowinning Process" in EPD Congress 1994, G. W. Warren, editor, The Minerals, Metals, and Materials Society, Warrendale, Pennsylvania (1994).

 

16. Alan C. West, "Comparison of Modeling Approaches for a Porous Salt Film," J. Electrochem. Soc., 140, 403 (1993).

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15.  Alan C. West, "Ohmic Interactions Within Electrode Ensembles," J. Electrochem. Soc., 140, 134 (1993).

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14. A. C. West, C. Madore, M. Matlosz, and D. Landolt, "Shape Changes During Through-Mask Electrochemical Etching of Thin Metal Films," Electrochemical Microfabrication, edited by Madhav Datta et al., PV 92-3, Electrochemistry Society, Pennington, NJ (1992).

 

13. A. C. West, R.-D. Grimm, D. Landolt, C. Deslouis, and B. Tribollet, "Electrohydrodynamic Impedance Study of Anodically Formed Salt Films on Iron in Chloride Solutions," J. Electroanalytical Chem., 330, 693 (1992).

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12. R.-D. Grimm, A. C. West and D. Landolt, "AC Impedance Study of Anodically Formed Salt Films on Iron in Chloride Solutions," J. Electrochem. Soc., 139, 1622 (1992).

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11. Alan C. West, Michael Matlosz, and D. Landolt, "Primary Current Distribution in the Hull Cell and Related Trapezoidal Geometries," J. Applied Electrochemistry, 22, 301 (1992).

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10. M. Matlosz, P.-H. Valloton, A. C. West, and D. Landolt, "Nonuniform Current Distribution and Thickness during Deposition onto Resistive Substrates," J. Electrochem. Soc., 139, 752 (1992).

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9. A. C. West, C. Madore, M. Matlosz, and D. Landolt, "Shape Changes During Through-Mask Electrochemical Micromachining of Thin Metal Films," J. Electrochem. Soc., 139, 499 (1992).

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8. C. Madore, A. C. West, M. Matlosz, and D. Landolt, "Design Considerations for a Cylindrical Hull Cell with Forced Convection," Electrochimica Acta, 37, 69 (1992).

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7.  Alan C. West and John Newman, "Determining Current Distributions Governed by Laplace's Equation," Modern Aspects of Electrochemistry ,23, edited by B. E. Conway et al. (1992).

 

6. Alan C. West and John Newman, "Current Distributions on Recessed Electrodes," J. Electrochem. Soc., 138, 1620 (1991).

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5. Alan C. West, Michael Matlosz, and D. Landolt, "Normalized and Average Current Distributions on Unevenly Spaced Patterns," J. Electrochem. Soc., 138, 728 (1991).

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4. Alan C. West, Johannes H. Sukamto, and John Newman, "A Criterion to Verify Current Distribution Calculations," J. Electrochem. Soc., 137, 2745 (1990).

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3. Alan C. West and John Newman, "Interpretation of Kinetic Rate Data Taken in a Channel Flow Cell," J. Electrochem. Soc., 136, 3755 (1989).

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2.  Alan C. West and John Newman, "Current Distribution Near an Electrode Edge as a Primary Distribution is Approached," J. Electrochem. Soc., 136, 2935 (1989).

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1. Alan C. West and John Newman, "Corrections to Kinetic Measurements Taken on a Disk Electrode," J. Electrochem. Soc., 136, 139 (1989).

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PATENTS

 

1. John T. Hachman, James J. Kelly, and Alan C. West, “Apparatus and Method for Controlling Plating Uniformity,” U.S. Patent No. 6802950 (2004).

 

2. E. F. Leonard, Z. Tang, A. C. West, and N. Shapley, “Systems and Methods of Blood-Based Therapies Having a Microfluidic Membraneless Exchange Device,”  U.S. Patent application Number 20040225249 (2004).

 

3. E. I. Cooper, H. Deligianni, P. Andricacos, B.S. Haran, M. Krishnan, J. M. Cotte, L. Economikos, D. F. Canaperi, E. G. Walton, S. Franz, A. P. Mansson, and A. C. West, “Methods and Compositions for Electro-Chemical-Mechanical Polishing,” U.S. and International Patent Application (2004).

 

4. Robert J. von Gutfeld and Alan C. West, “In Situ Plating and Etching of Materials Covered with a Surface Film,” U.S. Patent Application (2006).

 

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5. Robert J. von Gutfeld and Alan C. West, “Systems and Methods for Anisotropic Etching,” U.S. Patent Application (2006).

 

6. Alan C. West, Mark Willey, and Robert J. von Gutfeld, “Systems and Methods for Monitoring Plating Baths,” U.S. Patent Application (2006).

 

 7. Alan C. West and Mark Willey, “Systems and Methods for Screening Plating Baths,” U.S. Provisional Patent Application (2006).